Novel functionalized isocyanate groups polyhedral oligomeric silsesquioxanes/epoxy composites with advanced thermal and moisture resistance properties

作者：Wu, Zhiwen; Lu, Junhan; Jiang, Mingquan; Chen, Yi; Mai, Jun; Lin, Ruifen; Wang, Hui^*; Zhang, Jikang^*

来源：Journal of Applied Polymer Science, 2023, 140(37).

DOI：10.1002/app.54390

• dielectric behavior
• epoxy resin
• high heat resistance
• low water absorption
• POSS
• QCM

The rapid development of the electronic packaging industry has necessitated the production of epoxy resin insulation materials with high heat resistance and low water absorption. In this study a new cross-linking composite composed of polyhedral oligomeric silsesquioxane (POSS) functionalized with isocyanate groups and epoxy resin (EP) containing phenolic hydroxyl groups. By employing an isocyanate-hydroxyl process, the cage structure of Ph7POSS with isocyanate functionalization (MP) can be suspended on EP, leading to a significant improvement in the thermal and moisture resistance of the MP/EP composite. Our DSC and TGA studies revealed that the addition of 3% MP to the epoxy resin increased the glass transition temperature by 27.1 ? and raised the initial thermal breakdown temperature to 334.5 ?. We also utilized a novel quartz crystal microbalance (QCM) technique to continuously monitor the moisture resistance of the composite, and our results showed that the composite absorbed only 0.03% of water. Moreover, the porosity and cross-linking of the POSS molecules further restricted the movement of the polymer chains, thereby reducing the dielectric constant and dielectric loss of the composite. Consequently, the MP-modified epoxy composites exhibit excellent properties, which suggest promising applications in the field of electronic packaging.

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