摘要
Moistureand insulation deterioration are important factors thatcause the failure of epoxy packaging materials. Thus, improving thelong-term stability of epoxy resins in a hot and humid environmentis an important prerequisite for electronic components to adapt tocomplex working conditions and achieve high power densities. In thisstudy, fluorinated graphene doped with hydroxy-terminated poly(dimethylsiloxane)was prepared and self-assembled into a micro/nanostructure on thesurface of an epoxy resin, which effectively improved the surfacehydrophobicity of the epoxy resin. In addition, the doping with hydroxy-terminatedpoly(dimethylsiloxane) modified the fluorinated graphene filler, therebyforming an arch bridge energy band structure inside the epoxy resinand thus regulating carrier migration. The water absorption of theepoxy resin decreased from 1.02 to 0.24%, and the surface water contactangle increased from 93.58 to 133.2 & DEG;. Moreover, the electricalinsulation performance of the modified epoxy resin was greatly improvedwhen the surface resistivity and flashover voltage increased by 50.5and 36.4%, respectively. Therefore, the proposed method realizes asimultaneous improvement in the hydrophobicity and insulation of epoxyresins.