Low-Cycle Fatigue Behavior of Sn-0.3Ag-0.7Cu-0.5CeO2 Composite Solder Alloy

作者：Li, L.; Li, Z. H.^*; Tang, Y.; Li, G. Y.

来源：Journal of Electronic Materials, 2022, 51(12): 7313-7325.

DOI：10.1007/s11664-022-09958-0

• Low-cycle fatigue
• lead-free solder
• temperature effect
• frequency effect
• Coffin-Manson model

The low-cycle fatigue behavior of Sn-0.3Ag-0.7Cu-0.5CeO(2) composite solder alloy was studied. The results show that the fatigue life exponent and material ductility coefficient of the composite solder alloy are dependent on both temperature and frequency. A modified Coffin-Manson model considering the influence of frequency and temperature was put forward, and the relationship between temperature and the frequency exponent, low-cycle fatigue life exponent, and material ductility coefficient was established. The modified model has a good elimination effect on the influence of different frequencies and temperatures on the low-cycle fatigue life of the composite solder alloy.

• 单位
  广东技术师范学院; 中山大学