Broadcast-TDMA: A Cost-Effective Fault-Tolerance Method for TSV Lifetime Reliability Enhancement

Authors：Ni, Tianming; Bian, Jingchang; Yang, Zhao; Nie, Mu; Yao, Liang; Huang, Zhengfeng; Yan, Aibin^*; Wen, Xiaoqing

Source：IEEE Design & Test, 2022, 39(5): 34-42.

DOI：10.1109/MDAT.2022.3189827

• Through-silicon vias
• Reliability
• Three-dimensional displays
• Integrated circuits
• Fault tolerant systems
• Failure analysis
• Circuit faults
• 3D ICs
• through-silicon-via (TSV)
• lifetime reliability
• fault tolerance
• time division multiplexing access (TDMA)

Editor's notes: Through-silicon via (TSV) failure can occur due to various reliability issues. In this article, an interesting broadcast time-division multiplexing-access (TDMA) mechanism is used as a cost-effective fault-tolerance method for TSV yield improvement and lifetime enhancement. -Hailong Jiao, Peking University