ScholarMate
客服热线：400-1616-289

Broadcast-TDMA: A Cost-Effective Fault-Tolerance Method for TSV Lifetime Reliability Enhancement

Ni, Tianming; Bian, Jingchang; Yang, Zhao; Nie, Mu; Yao, Liang; Huang, Zhengfeng; Yan, Aibin*; Wen, Xiaoqing
Science Citation Index Expanded
-

摘要

Editor's notes: Through-silicon via (TSV) failure can occur due to various reliability issues. In this article, an interesting broadcast time-division multiplexing-access (TDMA) mechanism is used as a cost-effective fault-tolerance method for TSV yield improvement and lifetime enhancement. -Hailong Jiao, Peking University

关键词

Through-silicon vias Reliability Three-dimensional displays Integrated circuits Fault tolerant systems Failure analysis Circuit faults 3D ICs through-silicon-via (TSV) lifetime reliability fault tolerance time division multiplexing access (TDMA)