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Achieving high-strength W/W-10Cu joints by vacuum diffusion bonding with FeCoCu interlayer

Wei, Bangzheng; Zhou, Rui; Xu, Dang; Chen, Ruizhi; Chen, Pengqi; Cheng, Jigui*
SCIE
-

摘要

To obtain W/W-10Cu joints with reliable interface bonding, the surface of the W plate was roughened by oxi-dation-reduction treatment, and the treated W plate was joined to W-10Cu by vacuum diffusion bonding with FeCoCu medium-entropy alloy as an interlayer. The effects of oxidation temperature on the microstructure and properties of the W/W-10Cu joints were investigated. The stability of the obtained W/W-10Cu joints under transient thermal loads was investigated through thermal shock tests. The results show that the surface of the W plate became rough and loose after oxidation-reduction treatment. The surface roughness (Sa) of the W oxidised at 900 degrees C and then reduced in H2 at 850 degrees C was 1.833 mu m. The W/W-10Cu joints prepared from this W had a maximum shear strength of 254.0 MPa, 60% higher than that of the W/W-10Cu joints prepared from untreated W (157.9 MPa). After 50 thermal shock tests at 600 degrees C-RT, the shear strength of the W/W-Cu joints prepared from the treated W oxidised at 900 degrees C was 111.6 MPa; the shear strength of the W/W-Cu joints prepared from untreated W was 42.7 MPa. This study provides an effective method for preparing high-strength W/W-10 Cu joints.

关键词

W W-Cu joints Interfaces Shear strength Thermal shocks

出版信息

论文状态
公开发表
期刊名称
Fusion Engineering and Design
发表日期
2023-6
卷
191
期
-
页码
113553
DOI
10.1016/j.fusengdes.2023.113553

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