Microstructure and Electrical Resistivity of In Situ Cu-Fe Microcomposites

Authors：Liu, Keming^*; Sheng, Xiaochun; He, Guangyu; Han, Ningle; Li, Mulin; Zhang, Mengcheng; Zou, Jin; Atrens, Andrej; Huang, Huiming

Source：JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, 2022, 31(5): 3896-3901.

DOI：10.1007/s11665-021-06485-7

• Cu-Fe
• electrical resistivity
• evolution
• microcomposite
• microstructure

This paper studied the electrical resistivity of in situ Cu-Fe microcomposites using theoretical analysis and experiments. The model alloys Cu-XFe (X = 3, 4.3, 11, 14 and 17 wt.%) were produced by casting, and the microcomposites were prepared by thermomechanical treatment. The solid solubility of iron in the copper matrix was measured using an energy dispersive spectrometer. The electrical resistivity and conductivity was evaluated using a micro-ohmmeter. The conductivity of the Cu-XFe (X = 3 and 4.3) was essentially constant at similar to 40% IACS. The conductivity of the Cu-XFe (X = 11, 14, 17) microcomposites decreased in a nonlinear manner with increasing iron content and increasing cold deformation strain, which was mainly determined by the interface scattering resistivity caused by the interface between the copper matrix and the iron fibers.