Thermoplastic and low dielectric constants polyimides based on BPADA-BAPP

作者：Qiu, Guorong; Ma, Wenshi^*; Wu, Li

来源：Polymer-Plastics Technology and Materials, 2020, 59(13): 1482-1491.

DOI：10.1080/25740881.2020.1750651

• Polyimides
• thermoplastic
• low dielectric constants
• molecular simulation
• thermal properties

The thermoplastic and low dielectric constants polyimides were introduced. The polyimides were prepared by pyromellitic dianhydride (PMDA) or 4,4MODIFIER LETTER PRIME-(4,4MODIFIER LETTER PRIME-Isopropylidenediphenoxy)diphthalic anhydride (BPADA) as anhydride monomer and 4,4MODIFIER LETTER PRIME-oxydianiline (ODA) or 2,2-bis(4-(4-aminephenoxy)phenyl)propane (BAPP) as amine monomer. The polyimides were well characterized by FT-IR, thermogravimetric analysis, dynamic thermomechanical analysis, dielectric measurement, and tensile test. The dielectric constants were 2.32-2.95 compared with 3.10 of ODA-PMDA polyimide, while partly polyimides were thermoplastic. The results indicated anhydride monomers, containing lateral methyl groups, made polyimides become thermoplastic. The results of molecular simulations via Materials Studio also proved this conclusion.