科研之友
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摘要
The voids distribution uniformity within the bonding layer has emerged as a critical factor affecting thermal reliability of light-emitting diodes (LEDs), while the absence of quantitative characterization poses challenges in accurately assessing its impact and optimized design. In this study, a calculation method for the uniformity coefficient of the bonding layer voids distribution is proposed, revealing the impact of voids uniformity on the thermal performance of the device. We have investigated the influence of the number of voids and divided grids on the uniformity coefficient, establishing the criterion of saturated grid number. Results show that the decrease of the voids distribution uniformity coefficient leads to a lower thermal resistance and junction temperature, demonstrating that more uniformly distributed voids in the bonding layer are beneficial to improve the heat conduction path. This work reveals a significant correlation between the thermal performance of LED devices and the voids distribution uniformity coefficient, providing valuable insights for understanding and controlling the voids distribution to achieve effective heat dissipation of such devices.
