科研之友
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摘要
A dense and uniform W-15Cu composite material was successfully prepared by adding different amounts of silver as the active agent followed by direct sintering and infiltration. The effects of silver additive content on the microstructure and properties of W-15Cu composites under the prefabricated tungsten skeleton re-osmosis copper process and direct sintering infiltration were studied by scanning electron microscopy (SEM), X-ray diffractometer and laser thermal conductivity analyzer. When using direct infiltration sintering, adding an appropriate amount of silver eliminated pores and promoted densification, thereby increasing the relative density of tungsten copper composites. When the silver content was 2.0 wt%, the relative density was 96.58%, the thermal conductivity was up to 203.43 W/m.K, and the conductivity was 31.2% IACS. Compared with the W-15Cu composite material (26.4% IACS) prepared at the same process temperature, the conductivity of W-2.0Ag13Cu was increased by about 18.2%, and the Vickers hardness was 262 HV. The fracture morphology analysis of the tungsten-copper composites showed that the addition of Ag enhanced the interfacial bonding of the sintered composite materials and formed an ideal tungsten-copper network structure. The fracture modes were the ductile fracture of the Cu-Ag matrix and the brittle fracture of the W phase.
