Microstructure regulation of Sn-3.0Ag-0.5Cu micro-solder joints by hybridizing nano-TiO2

作者：Li, Zhenlong^*; Cheng, Lanxian; Li, Guoyuan

来源：Microelectronics and Reliability, 2022, 131: 114515.

DOI：10.1016/j.microrel.2022.114515

• Micro-solder joint
• Intermetallic growth
• Activation energy
• Nano-TiO 2 addition

The intermetallic compound (IMC) formation kinetics of Sn-3.0Ag-0.5Cu micro-solder joints were studied under 100 ?C, 120 ?C, and 150 ?C isothermal aging test. The addition of nano-TiO2 has a great influence on interface reaction, significantly reducing the thickness of IMC. The thickness of IMC layer is able to be regulated by controlling the doping concentration, and the minimum value was achieved with 0.1 wt% doping. The activation energy of IMC formation was approved to be raised after the composite of nano-TiO2, which can further decrease the atomic diffusion rate, and eventually block the overgrowth of IMC. Grain boundary pinning mechanism is regarded as the most important mechanism for inhibiting the growth of IMC because of nano-TiO2 addition.

• 单位
  华南农业大学