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A new reutilization strategy of waste printed circuit board nonmetal powders for constructing superhydrophobic coatings

Liu, Wei; Hu, Dechao; Liu, Huaqing; Ma, Wenshi*
Science Citation Index Expanded
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摘要

Reutilization of waste printed circuit board nonmetal powders (WPCBP) has been one of the major bottlenecks in the comprehensive utilization of electronic wastes. Herein, a new reutilization strategy of WPCBP was innovatively proposed to develop a superhydrophobic coating. Typically, WPCBP@SiO2 hybrid filler was successfully prepared by the in-situ growth of silica on WPCBP surface, and the structures and compositions of WPCBP@SiO2 were systematically investigated by SEM, FTIR, and TGA. Then the obtained WPCBP@SiO2 was combined with polydimethylsiloxane (PDMS) to prepare a superhydrophobic coating. The as-prepared PDMS/WPCBP@SiO2 coatings exhibited excellent superhydrophobicity and self-cleaning ability, whose static water contact angle (WCA) is more than 150 degrees while the sliding angle (SA) is <10 degrees. In summary, this study provides a green and efficient reutilization strategy of WPCBP in superhydrophobic coatings, which may open up a new opportunity for the high-valued utilization of WPCBP.

关键词

hybrid filler reutilization superhydrophobic coating waste printed circuit board