摘要

The microscopic explanation of the elongation variation in a Fe-0.5 wt.% Si alloy during electrically assisted forming (EAF) was investigated. Specimens were electrically stretched, measured with electron backscattered diffraction (EBSD). Results show that there is a positive linear relationship between material elongation and the ratio of maximum special grain boundary cluster size and grain size, while the maximum special grain boundary cluster size is closely related to the fraction of special grain boundaries and triple junction distribution. The effect of electric current on the fraction and characteristic distribution of special grain boundaries is significant and can be attributed to that electric current has an influence on dislocations and then recovery and grain growth. Cooling condition has a complex effect on special grain boundaries and grain size. The distribution of special grain boundaries in triple junctions during EAF does not conform to random distribution. The variation of material elongation during EAF is attributed to the change of microcrack propagation behavior caused by the change of special grain boundary cluster size and grain size.

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