Effect of Thermal Aging on the Interfacial Reaction Behavior and Failure Mechanism of Ni-xCu/Sn Soldering Joints under Shear Loading

作者：Li, Zhigang; Cheng, Kai; Liu, Jiajun; He, Yigang; Xiao, Yong^*

来源：Materials, 2023, 16(15): 5253.

DOI：10.3390/ma16155253

• Ni-xCu
• Sn soldering joints
• solid-state reaction
• intermetallic compounds
• thermal aging
• mechanical properties

Ni-xCu/Sn soldering joints were aged at 200 & DEG;C, and the microstructure evolution and mechanical properties during the solid-state reaction were studied under shear loading. Results showed that the intermetallic compounds (IMCs) exhibited a Cu content-dependent transformation from the (Ni,Cu)(3)Sn-4 phase to the (Cu,Ni)(6)Sn-5 phase at the Ni-xCu/Sn interface. Furthermore, a Cu3Sn layer was observed exclusively at the Cu/Sn interface. The shear strength of the soldering joints after thermal aging exhibited an initial decrease followed by an increase, except for a significant enhancement at the Cu content of 60 wt.%. In addition, the evolution law of mechanical properties and failure mechanism of the thermal aging joints were elucidated based on the fracture microstructure and the fracture curve of the joints.

• 单位
  y; 武汉理工大学