摘要
A micro-jet impingement heat sink (MJHS) was designed in this work, and its heat transfer performance and temperature uniformity were investigated. Concurrently, the operating limit heating power of MJHS was predicted. Besides, the key jet impingement structure parameters of MJHS were studied by simulation, and the better performance structures of jet impingement were experimentally verified. Results show that the MJHS is expected to cool 359.13 W thermal power electronics to below 76.7 degrees C at 2.0 L/min flow rate. As X-n/d increases from 2.0 to 11.25, the thermal resistance of MJHS decreases by 10.6%, and its temperature uniformity improved by at least 21.1% . As Y-n/d decreases from 6.0 to 3.0, the thermal resistance of MJHS decreases by 12.2%, and its temperature uniformity improves by at least 17% .This indicates that increasing the streamwise jet-to-jet spacing, or reducing the jet hole-to-target plate distance is beneficial for improving the performance of MJHS. The current study would provide some valuable references for improved heat transfer performance of MJHS and the heat dissipation of high heat flux electronic devices.