摘要
In order to enhance the moisture resistance of cyanate ester resins, modifiers containing silicon or fluorine moieties were introduced. The curing behaviors of the obtained resins, as well as thermal, water absorption, and dielectric properties of all cured polymers, were investigated in detail. Results show that properties of fillers in polymer have great influence on the thermal property and of polymer. In all cases, modifier exhibited percolation threshold at 5 wt%. Compared with pristine cyanate ester resins (CE), when the methyl phenyl silicone resin B filler was added, the cured polymer exhibited water absorption as low as 0.39% and excellent thermal oxygen stability at 300 degrees C. The introduction of silicon H improved thermal oxidative stability at 400 degrees C without significant compromise in processability or mechanical properties.
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单位中国科学院