摘要
We propose an epoxy molding compound (EMC) encapsulation method based on a metallized reflector to enhance light extraction of deep ultraviolet light-emitting diodes (DUV-LEDs). From the optical simulation, the highest light output efficiency of the DUV-LEDs is measured when the angle of the metallied reflector is 35(degrees) and the height is 0.5-mm. The optimized EMC structure is fabricated for application to DUV-LEDs packaging. The light output power of the EMC metallized reflector is improved by 14.3% compared to the conventional ceramic package at 20-mA. The thermal resistance of the EMC is 18.16-K/W. Furthermore, after aging tests at 60 degree celsius and 60 degree celsius, 90 %RH for 1000h, the relative light output power of the EMC metallized reflector is decreased by 12% and 14%, respectively.