Realizing high-strength diffusion bonding of copper at ultra-low temperatures via single point diamond turning and spark plasma sintering

作者：Li, Wendi; Liang, Yuxin; Bai, Yang; Lin, Tiesong; Li, Bangsheng^*; Fu, Zhiqiang; Feng, Jicai^*

来源：Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing , 2022, 857: 144116.

DOI：10.1016/j.msea.2022.144116

• Diffusion bonding
• Copper
• Spark plasma sintering
• Single point diamond turning

Single point diamond turning (SPDT) could produce nanoscale surface roughness and surface nanograins. When subsequently heated by spark plasma sintering (SPS), the SPDT processed copper realized diffusion bonding at an ultra-low temperature of-202 degrees C (0.35 Tm). Finally, high-strength (-269 MPa) diffusion bonding of copper was achieved via SPDT and SPS.